標(biāo)準(zhǔn)號：IEC 61188-1-1-1997
中文標(biāo)準(zhǔn)名稱：印制電路板和印制電路板組件 設(shè)計和使用 第1-1部分:一般要求 電子組件的平整度情況
英文標(biāo)準(zhǔn)名稱：Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
標(biāo)準(zhǔn)類型：L30
發(fā)布日期：1999/12/31 12:00:00
實(shí)施日期：1999/12/31 12:00:00
中國標(biāo)準(zhǔn)分類號：L30
國際標(biāo)準(zhǔn)分類號：31.190
適用范圍：This part of IEC 61188 describes those factors which control the flatness of rigid printed boards and their assemblies. The object of this standard is to inform the designer, manufacturer, assembler and user of rigid printed boards and their assemblies about those factors affecting their flatness. This standard incorporates advice regarding: - design (clause 3); - base material (clause 4); - unassembled printed boards (clause 5); - printed board assemblies (clause 6).