標準號：BS EN 60191-6-5-2001
中文標準名稱：半導體器件機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則.小螺距球柵陣列的設計指南
英文標準名稱：Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitchball grid array (FBGA)
標準類型：L90
發布日期：2001/11/15 12:00:00
實施日期：2001/11/15 12:00:00
中國標準分類號：L90
國際標準分類號：01.100.25;31.240
適用范圍：This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The demand for area array style packages exists according to the multi-functioning and high performance of electrical equipment. The object of this design guide is to standardize outlines and secure interchangeability of FBGA packages. The terminal pitch and package outlines of these fine-pitch array packages are smaller than those of BGA packages.