標(biāo)準(zhǔn)號(hào)：BS EN 60512-12-7-2001
中文標(biāo)準(zhǔn)名稱(chēng)：電子設(shè)備機(jī)電元件.基本試驗(yàn)程序和測(cè)量方法.軟釬焊試驗(yàn).試驗(yàn)12g.可釬焊性.濕平衡法.第7節(jié):試驗(yàn)12g.可釬焊性.濕平衡法
英文標(biāo)準(zhǔn)名稱(chēng)：Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Soldering tests - Test 12g - Solderability, wetting balance method - Section 7: Test 12g: Solderability, wetting balance method
標(biāo)準(zhǔn)類(lèi)型：L10
發(fā)布日期：2001/8/15 12:00:00
實(shí)施日期：2001/9/15 12:00:00
中國(guó)標(biāo)準(zhǔn)分類(lèi)號(hào)：L10
國(guó)際標(biāo)準(zhǔn)分類(lèi)號(hào)：31.220.10
適用范圍：This part of IEC 60512, when required by the detail specification, is to be used for testing connectors within the scope of IEC technical committee 48. This test may also be used for similar components when specified in a detail specification. The object of this test is to define a standard test method to assess the solderability of the terminations of a component designed for use with printed boards or for other applications using similar soldering techniques.