標準號：BS EN 61190-1-3-2007+A1-2010
中文標準名稱：電子組件用連接材料.電子焊接用電子級釬焊合金及有焊劑和無焊劑的固體焊料用要求
英文標準名稱：Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
標準類型：J33
發布日期：2007/7/31 12:00:00
實施日期：2007/7/31 12:00:00
中國標準分類號：J33
國際標準分類號：31.190
適用范圍：This part of IEC 61190 prescribes the requirements and test methods for electronic gradesolder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, forelectronic soldering applications and for “special” electronic grade solders. For the genericspecifications of solder alloys and fluxes, see ISO 9453, ISO 9454-1 and ISO 9454-2. Thisstandard is a quality control document and is not intended to relate directly to the material'sperformance in the manufacturing processSpecial electronic grade solders include all solders which do not fully comply with therequirements of standard solder alloys and solder materials listed herein. Examples of specialsolders include anodes, ingots, preforms, bars with hook and eye ends, multiple-alloy solderpowders, etc.