標準號：BS EN 61188-5-5-2007
中文標準名稱：印制電路板和印制電路板組件.設計和使用.第5-5部分:焊接(焊接區/焊縫)考慮.四面帶有翅形引線的部件
英文標準名稱：Printed boards and printed board assemblies - Design and use - Attachment (land/joint) considerations - Components with gull- wing leads on four sides
標準類型：L30
發布日期：2007/12/31 12:00:00
實施日期：2007/12/31 12:00:00
中國標準分類號：L30
國際標準分類號：31.180
引用標準：IEC 61188-5-1
適用范圍：This part of IEC 61188 provides information on land pattern geometries used for the surfaceattachment of electronic components with gull-wing leads on four sides. The intent of theinformation presented herein is to provide the appropriate size, shape and tolerances ofsurface mount land patterns to ensure sufficient area for the appropriate solder fillet, and alsoallow for inspection, testing and reworking of those solder joints.Each clause contains a specific set of criteria such that the information presented isconsistent, providing information on the component, the component dimensions, the solderjoint design and the land pattern dimensions.The land pattern dimensions are based on a mathematical model that establishes a platformfor a solder joint attachment to the printed board. The existing models create a platform that iscapable of establishing a reliable solder alloy used to make that joint (lead-free, tin lead, etc.).Process requirements for solder reflow are different based on the solder alloy and should beanalyzed in order that the process is above that temperature a sufficient time to form areliable metallurgical bond.