標(biāo)準(zhǔn)號(hào)：IEC 62258-5-2006
中文標(biāo)準(zhǔn)名稱：半導(dǎo)體壓模產(chǎn)品.第5部分:關(guān)于電子模擬的信息要求
英文標(biāo)準(zhǔn)名稱：Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
標(biāo)準(zhǔn)類型：L55
發(fā)布日期：1999/12/31 12:00:00
實(shí)施日期：1999/12/31 12:00:00
中國(guó)標(biāo)準(zhǔn)分類號(hào)：L55
國(guó)際標(biāo)準(zhǔn)分類號(hào)：31.080.99;31.200
適用范圍：This part of IEC 62258 has been developed to facilitate the production, supply and use ofsemiconductor die products, including:– wafers;– singulated bare die;– die and wafers with attached connection structures;– minimally or partially encapsulated die and wafers.This part of IEC 62258 specifies the information required to facilitate the use of electrical dataand models for simulation of the electrical behaviour and verification of the correct functionalityof electronic systems that include bare semiconductor die, with or without connectionstructures, and/or minimally packaged semiconductor die. It is intended to assist all thoseinvolved in the supply chain for die devices to comply with the requirements of IEC 62258-1and IEC 62258-2.