標(biāo)準(zhǔn)號：BS EN 62258-5-2006
中文標(biāo)準(zhǔn)名稱：半導(dǎo)體壓模制品.關(guān)于電子模擬的信息要求
英文標(biāo)準(zhǔn)名稱：Semiconductor die products - Requirements for information concerning electrical simulation
標(biāo)準(zhǔn)類型：L40
發(fā)布日期：2006/11/30 12:00:00
實施日期：2006/11/30 12:00:00
中國標(biāo)準(zhǔn)分類號：L40
國際標(biāo)準(zhǔn)分類號：31.200
引用標(biāo)準(zhǔn)：IEC 62258-1;IEC 62258-2
適用范圍：This part of IEC 62258 has been developed to facilitate the production, supply and use ofsemiconductor die products, including:– wafers;– singulated bare die;– die and wafers with attached connection structures;– minimally or partially encapsulated die and wafers.This part of IEC 62258 specifies the information required to facilitate the use of electricaldata and models for simulation of the electrical behaviour and verification of the correctfunctionality of electronic systems that include bare semiconductor die, with or withoutconnection structures, and/or minimally packaged semiconductor die. It is intended to assistall those involved in the supply chain for die devices to comply with the requirements ofIEC 62258-1 and IEC 62258-2.