標(biāo)準(zhǔn)號(hào)：IEC/PAS 62169 Edition 1.0-2000
中文標(biāo)準(zhǔn)名稱：處理、包裝、船用和潮濕/回流敏感表面固定裝置的標(biāo)準(zhǔn)
英文標(biāo)準(zhǔn)名稱：Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices
標(biāo)準(zhǔn)類型：L15
發(fā)布日期：1999/12/31 12:00:00
實(shí)施日期：1999/12/31 12:00:00
中國(guó)標(biāo)準(zhǔn)分類號(hào)：L15
國(guó)際標(biāo)準(zhǔn)分類號(hào)：31.080.01
適用范圍：3.2 Assembly processes3.2.1 This standard applies to bulk solder reflow assembly by convection, convection/IR, infrared (IR),and vapor phase reflow (VPR) processes. It does not apply to bulk solder reflow processes that immersethe component bodies in molten solder (e.g., backside wave solder). Such processes are not allowed formany SMDs and are not covered by the component qualifications standards used as a basis for thisdocument.3.2.2 This standard also applies to moisture sensitive components that are removed or attached singly bylocal ambient heating, i.e., “hot air rework.”3.2.3 This standard does not apply to components that are socketed and not exposed to solder reflowtemperatures. Such components are not at risk and do not require moisture precautionary handling.3.2.4 This standard does not apply to components in which only the leads are heated to reflow the solder,e.g., hand-soldering, hot bar attach of gull wing leads, and pin-thru-hole with backside wave solder. Theheat absorbed by the package body from such operations is typically much lower than for bulk surfacemount reflow or hot air rework, and moisture precautionary measures are typically not needed.3.3 Reliability3.3.1 The methods set forth in this specification ensure that adequate component reliability, as evaluatedand verified by J-STD-020 and/or by JESD22-A113 plus environmental reliability testing, is maintainedduring and after the PCB assembly operation.3.3.2 This specification does not address or ensure solder joint reliability of attached components.