標(biāo)準(zhǔn)號(hào)：IEC 60748-21-1-1997
中文標(biāo)準(zhǔn)名稱：半導(dǎo)體器件 集成電路 第21-1部分:實(shí)行鑒定批準(zhǔn)程序的膜集成電路和混合膜集成電路空白詳細(xì)規(guī)范
英文標(biāo)準(zhǔn)名稱：Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
標(biāo)準(zhǔn)類(lèi)型：L56
發(fā)布日期：1999/12/31 12:00:00
實(shí)施日期：1999/12/31 12:00:00
中國(guó)標(biāo)準(zhǔn)分類(lèi)號(hào)：L56
國(guó)際標(biāo)準(zhǔn)分類(lèi)號(hào)：31.200
適用范圍：Semiconductor devices -Integrated circuits -Characteristics and conditions of use.....................................................................Recommended methods of mounting.....................................................................Marking.................................................................................................................Ordering information..............................................................................................Certified records of released lots...........................................................................Additional information............................................................................................Additional or increased severities or requirements to those specified in the generic and/or sectional specification.................................................................................Inspection requirements (see tables 2 and 3 or 4 and 5).........................................Supplement -Tables of method B..........................................................................Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures