標(biāo)準(zhǔn)號：BS EN 62258-2-2011
中文標(biāo)準(zhǔn)名稱：半導(dǎo)體壓模制品.交換數(shù)據(jù)格式.
英文標(biāo)準(zhǔn)名稱：Semiconductor die products. Exchange data formats
標(biāo)準(zhǔn)類型：L40
發(fā)布日期：2011/7/31 12:00:00
實施日期：2011/7/31 12:00:00
中國標(biāo)準(zhǔn)分類號：L40
國際標(biāo)準(zhǔn)分類號：31.080.99
引用標(biāo)準(zhǔn)：IEC 62258-1;IEC 61360-4-2005;ISO 8601-2004;ISO 6093-1985;IPC/JEDEC J-STD-033B-2007;ISO 10303-21-2002
適用范圍：This Part of IEC 62258 specifies the data formats that may be used for the exchange of datawhich is covered by other parts of the IEC 62258 series, as well as definitions of all parametersused according to the principles and methods of IEC 61360. It introduces a Device DataExchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometricdata between die manufacturer and CAD/CAE user and formal information models that allowdata exchange in other formats such as STEP physical file format, in accordance withISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usagebeyond this initial scope.It has been developed to facilitate the production, supply and use of semiconductor dieproducts, including but not limited to:? wafers,? singulated bare die,? die and wafers with attached connection structures,? minimally or partially encapsulated die and wafers.This standard reflects the DDX data format at version 1.3.0