標(biāo)準(zhǔn)號(hào)：IEC 61188-5-5-2007
中文標(biāo)準(zhǔn)名稱(chēng)：印制板和印制板組件.設(shè)計(jì)和使用.第5-5部分:焊接(焊接區(qū)/接縫)考慮.四面帶有翅形引線的部件
英文標(biāo)準(zhǔn)名稱(chēng)：Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
標(biāo)準(zhǔn)類(lèi)型：L30
發(fā)布日期：1999/12/31 12:00:00
實(shí)施日期：1999/12/31 12:00:00
中國(guó)標(biāo)準(zhǔn)分類(lèi)號(hào)：L30
國(guó)際標(biāo)準(zhǔn)分類(lèi)號(hào)：31.180
適用范圍：This part of IEC 61188 provides information on land pattern geometries used for the surfaceattachment of electronic components with gull-wing leads on four sides. The intent of theinformation presented herein is to provide the appropriate size, shape and tolerances ofsurface mount land patterns to ensure sufficient area for the appropriate solder fillet, and alsoallow for inspection, testing and reworking of those solder joints.Each clause contains a specific set of criteria such that the information presented isconsistent, providing information on the component, the component dimensions, the solderjoint design and the land pattern dimensions.The land pattern dimensions are based on a mathematical model that establishes a platformfor a solder joint attachment to the printed board. The existing models create a platform that iscapable of establishing a reliable solder alloy used to make that joint (lead-free, tin lead, etc.).Process requirements for solder reflow are different based on the solder alloy and should beanalyzed in order that the process is above that temperature a sufficient time to form areliable metallurgical bond.