標(biāo)準(zhǔn)號：BS EN 60749-15-2010
中文標(biāo)準(zhǔn)名稱：半導(dǎo)體器件.機械和氣候試驗方法.穿孔安裝設(shè)備的耐焊接溫度性
英文標(biāo)準(zhǔn)名稱：Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices
標(biāo)準(zhǔn)類型：L40
發(fā)布日期：2011/2/28 12:00:00
實施日期：2011/2/28 12:00:00
中國標(biāo)準(zhǔn)分類號：L40
國際標(biāo)準(zhǔn)分類號：31.080.01
適用范圍：This part of IEC 60749 describes a test used to determine whether encapsulated solid statedevices used for through-hole mounting can withstand the effects of the temperature to whichthey are subjected during soldering of their leads by using wave soldering or a soldering iron.In order to establish a standard test procedure for the most reproducible methods, the solderdip method is used because of its more controllable conditions. This procedure determineswhether devices are capable of withstanding the soldering temperature encountered in printedwiring board assembly operations, without degrading their electrical characteristics or internalconnections.This test is destructive and may be used for qualification, lot acceptance and as a productmonitor.This test is, in general, in conformity with IEC 60068-2-20 but, due to specific requirements ofsemiconductors, the clauses of this standard apply.