標準號：ANSI/ASTM F542-2007
中文標準名稱：電子元件及微電子元件封裝用密封化合物發熱溫度的試驗方法
英文標準名稱：Test Method for Exothermic Temperature of Encapsulating Compounds for Electronic and Microelectronic Encapsulation
標準類型：L94
發布日期：2007/5/22 12:00:00
實施日期：1999/12/31 12:00:00
中國標準分類號：L94
國際標準分類號：31.240
適用范圍： This test method provides results that are related to the maximum temperature reached in a specific volume by a reacting liquid encapsulating compound, and the time from initial mixing to the time when this peak exothermic temperature is reached. This test method provides a means to measure the peak exothermic temperature of an encapsulating compound. This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements see Section 8. Note 1There is no equivalent IEC standard.