標(biāo)準(zhǔn)號：BS EN 60664-3-2003+A1-2010
中文標(biāo)準(zhǔn)名稱：低壓系統(tǒng)內(nèi)設(shè)備的絕緣配合.防污染用涂覆,灌封或模壓的使用
英文標(biāo)準(zhǔn)名稱：Insulation coordination for equipment within low-voltage systems - Use of coating, potting or moulding for protection against pollution
標(biāo)準(zhǔn)類型：K30
發(fā)布日期：2003/6/9 12:00:00
實施日期：2003/6/9 12:00:00
中國標(biāo)準(zhǔn)分類號：K30
國際標(biāo)準(zhǔn)分類號：29.080.30
適用范圍：This part of IEC 60664 applies to assemblies protected against pollution by the use ofcoating, potting or moulding, thus allowing a reduction of clearance and creepage distancesas described in Part 1 or Part 5.This standard describes the requirements and test procedures for two methods of protection:– type 1 protection improves the microenvironment of the parts under the protection;– type 2 protection is considered to be similar to solid insulation.This standard also applies to all kinds of protected printed boards, including the surface ofinner layers of multi-layer boards, substrates and similarly protected assemblies. In the caseof multi-layer printed boards, the distances through an inner layer are covered by therequirements for solid insulation in Part 1.This standard refers only to permanent protection. It does not cover assemblies that aresubjected to mechanical adjustment or repair.The principles of this standard are applicable to functional, basic, supplementary andreinforced insulation.