標(biāo)準(zhǔn)號(hào)：IEC 60191-6-5-2001
中文標(biāo)準(zhǔn)名稱：半導(dǎo)體器件的機(jī)械標(biāo)準(zhǔn)化 第6-5部分：表面安裝半導(dǎo)體器件封裝外形圖繪制的一般規(guī)則 小螺距球狀網(wǎng)格陣列（FBGA）的設(shè)計(jì)指南
英文標(biāo)準(zhǔn)名稱：Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA)
標(biāo)準(zhǔn)類型：L04;L40
發(fā)布日期：1999/12/31 12:00:00
實(shí)施日期：1999/12/31 12:00:00
中國(guó)標(biāo)準(zhǔn)分類號(hào)：L04;L40
國(guó)際標(biāo)準(zhǔn)分類號(hào)：01.100.25;31.240
適用范圍：This part of IEC 60191 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array (hereinafter called FBGA), whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square. The demand for area array style packages exists according to the multi-functioning and high performance of electrical equipment. The object of this design guide is to standardize outlines and secure interchangeability of FBGA packages. The terminal pitch and package outlines of these fine-pitch array packages are smaller than those of BGA packages.