標(biāo)準(zhǔn)號(hào)：BS EN 62326-4-1-1997
中文標(biāo)準(zhǔn)名稱：印制電路板.層間連接剛性印制電路板.分規(guī)范.性能詳細(xì)規(guī)格.A,B和C級(jí)性能水平
英文標(biāo)準(zhǔn)名稱：Printed boards - Rigid multilayer printed boards with interlayer connections - Sectional specification - Capability detail specification - Performance levels, A, B and C
標(biāo)準(zhǔn)類型：L30
發(fā)布日期：1997/6/15 12:00:00
實(shí)施日期：1997/6/15 12:00:00
中國(guó)標(biāo)準(zhǔn)分類號(hào)：L30
國(guó)際標(biāo)準(zhǔn)分類號(hào)：31.180
適用范圍：This Capability Detail Specification (Cap DS) is based on IEC 2326-4. It relates to rigid multilayer printed boards with interiayer connections manufactured with materials specified in 3.1. It specifies the capability qualifying component (CQC), the characteristics to be tested, the test methods and conditions to be applied and the requirements to be fulfilled for testing capability for performance level A, B or C.