標(biāo)準(zhǔn)號(hào)：IEC 60191-5-1997
中文標(biāo)準(zhǔn)名稱：半導(dǎo)體器件的機(jī)械標(biāo)準(zhǔn)化 第5部分:用于集成電路載帶自動(dòng)焊(TAB)的推薦值
英文標(biāo)準(zhǔn)名稱：Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)
標(biāo)準(zhǔn)類型：L55
發(fā)布日期：1999/12/31 12:00:00
實(shí)施日期：1999/12/31 12:00:00
中國標(biāo)準(zhǔn)分類號(hào)：L55
國際標(biāo)準(zhǔn)分類號(hào)：31.200;55.060
適用范圍：This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).