標準號：BS EN 61249-8-8-1997
中文標準名稱：連接結構用材料.非導電膜和涂層分規范.臨時聚合物規范
英文標準名稱：Materials for interconnection structures - Sectional specification set for non-conductive films and coatings - Temporary polymer coatings
標準類型：L30
發布日期：1997/12/15 12:00:00
實施日期：1997/12/15 12:00:00
中國標準分類號：L30
國際標準分類號：31.180
適用范圍：This specification within the IEC 61249 series details requirements for the qualification of temporary solder resist coatings. These have been referred to as a mask in this specification since they have the facility of being readily removed. Peelable solder masks are applied (usually by screen printing) to areas of a completed printed board or panel prior to shipment, in order to protect areas of the board or panel during subsequent processes by the board assembler. Typically, peelable solder masks are used to protect keypad contacts during fluxing and subsequent mass soldering. Removal of the mask will then leave a residue-free untinned contact area. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks. Requirements for the release of printed boards using peelabie solder masks should be included in the Customer Detail Specification (CDS). Requirements for the qualification of permanent polymeric solder resistive coatings are given in IEC 61249-8-5