標(biāo)準(zhǔn)號(hào)：BS EN 4660-004-2011
中文標(biāo)準(zhǔn)名稱：航空航天系列.模塊化和開(kāi)放式航空電子體系結(jié)構(gòu).包裝
英文標(biāo)準(zhǔn)名稱：Aerospace series. Modular and open avionics architectures. Packaging
標(biāo)準(zhǔn)類型：V41
發(fā)布日期：2011/3/31 12:00:00
實(shí)施日期：2011/3/31 12:00:00
中國(guó)標(biāo)準(zhǔn)分類號(hào)：V41
國(guó)際標(biāo)準(zhǔn)分類號(hào)：49.090
適用范圍：The purpose of this standard is to establish uniform requirements for Packaging for the Common FunctionalModules (CFM) within an Integrated Modular Avionic (IMA) system, as defined per ASAAC. It comprises themodule physical properties and the Module Physical Interface (MPI) definitions together with guidelines for IMArack and the operational environment.The characteristics addressed by the Packaging Standard are:Interchangeability:? For a given cooling method all modules conforming to the packaging standard will function correctly wheninserted into any rack slot conforming to the standard for the cooling method.? All modules conforming to the Module Physical Interface (MPI) definitions for connector, IED and coolinginterface will function correctly when inserted into any rack slot conforming to the same MPI definition.Maintainability:? All modules are easily removable at first line.? No special tools required at first line.? No manual adjustment is necessary when installing modules. No tool is required for installation or removalof the modules.? Mechanical keying is provided that prevents insertion of a module into a rack slot that may cause an unsafecondition.The Module Physical Interface definition, contained within this standard, does not include the properties of thesignalling used in the optical interface (e.g. wavelength). These are covered in EN 4660-003.