標準號：IEC 62258-6-2006
中文標準名稱：半導體壓模產品.第6部分:關于熱模擬的信息要求
英文標準名稱：Semiconductor die products - Part 6: Requirements for information concerning thermal simulation
標準類型：L57
發布日期：1999/12/31 12:00:00
實施日期：1999/12/31 12:00:00
中國標準分類號：L57
國際標準分類號：31.080.99;31.200
適用范圍：This part of IEC 62258 has been developed to facilitate the production, supply and use ofsemiconductor die products, including:? wafers;? singulated bare die;? die and wafers with attached connection structures;? minimally or partially encapsulated die and wafers.This part of IEC 62258 determines the information required to facilitate the use of thermaldata and models for simulation of the thermal behaviour and verification of the correctfunctionality of electronic systems that include bare semiconductor die, with or withoutconnection structures, and/or minimally packaged semiconductor die. It is intended to assistall those involved in the supply chain for die devices to comply with the requirements ofIEC 62258-1 and IEC 62258-2.