標(biāo)準(zhǔn)號：DIN EN 15190-2007
中文標(biāo)準(zhǔn)名稱：結(jié)構(gòu)膠粘劑.評估粘合金屬結(jié)構(gòu)的長期堅(jiān)固度用試驗(yàn)方法
英文標(biāo)準(zhǔn)名稱：Structural adhesives - Test methods for assessing long term durability of bonded metallic structures; German version EN 15190:2007
標(biāo)準(zhǔn)類型：G39
發(fā)布日期：1999/12/31 12:00:00
實(shí)施日期：1999/12/31 12:00:00
中國標(biāo)準(zhǔn)分類號：G39
國際標(biāo)準(zhǔn)分類號：83.180
引用標(biāo)準(zhǔn)：EN 923-2005;EN 13887;EN ISO 9142;ISO 15024
適用范圍：1.1 This standard specifies test procedures for determining the long-term durability of an adhesive systemsubjected to environmental and fatigue loads. The procedures are based upon measurement of the crackgrowth rate and the resistance to crack propagation through the adhesive layer in double cantilever beam typespecimens under an applied mode I opening cycling loading.1.2 The test specimens consist of rectangular metal substrates bonded together with a pre-starter crack inthe bondline. For testing joints consisting of relatively thin sheets of metallic substrates the specimen needs tobe structurally reinforced by adding layers of compatible material to the back of each adherend substrate inorder to prevent permanent deformation, usually referred to as reinforced double cantilever beam (RDCB) testspecimen.1.3 For brevity, the standard relates to testing RDCB specimens, which are essentially more complex inmanufacturing than standard double cantilever beam (DCB) specimens. However, the standard allows also foruse of single substrate double cantilever beam specimens when the substrate material is available in sufficientthickness.1.4 The test method has been proven to be particularly sensitive in finding weaknesses within certainadhesive systems and is recommended as a scientific tool to study adhesion properties. This test methodmay be used to determine:- The fatigue crack growth rate as a function of the mode I strain energy release rate;- The threshold values for negligible crack growth;- The effects of other environmental factors (temperature and/or humidity cycling);- The mode I (peel or crack opening) failure mode of the adhesive joint (cohesive, interfacial, near-surface ...).