標準號：BS EN 60749-20-1-2009
中文標準名稱：半導體器件.機械和氣候試驗方法.第20-1部分:對潮濕和焊接熱綜合效應敏感元器件的操作,包裝,標識和運輸
英文標準名稱：Semiconductor devices - Mechanical and climatic test methods - Part 20-1:Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
標準類型：L40
發布日期：2009/7/31 12:00:00
實施日期：2009/7/31 12:00:00
中國標準分類號：L40
國際標準分類號：31.080.01
引用標準：IEC 60749-20;IEC 60749-30
適用范圍：This part of IEC 60749 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air.The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date.Two test conditions, method A and method B, are specified in the soldering heat test of IEC 60749-20. For method A, moisture soak conditions are specified on the assumption that moisture content inside the moisture barrier bag is less than 30 % RH. For method B, moisture soaking conditions are specified on the assumption that manufacturer’s exposure time (MET) does not exceed 24 h and the moisture content inside the moisture barrier bag isless than 10 % RH. In an actual handling environment, SMDs tested by method A are permitted to absorb moisture up to 30 % RH, and SMDs tested by method B are permitted to absorb moisture up to 10 % RH. This standard specifies the handling conditions for SMDs subjected to the above test conditions.