標準號：IEC 60749-37-2008
中文標準名稱：半導體裝置.機械和氣候試驗方法.第37部分:用加速計的電路板級落錘試驗方法
英文標準名稱：Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
標準類型：L30
發布日期：1999/12/31 12:00:00
實施日期：1999/12/31 12:00:00
中國標準分類號：L30
國際標準分類號：31.080.01
引用標準：IEC 60749-10-20002;IEC 60749-20;IEC 60749-20-1
適用范圍：This part of IEC 60749 provides a test method that is intended to evaluate and compare dropperformance of surface mount electronic components for handheld electronic productapplications in an accelerated test environment, where excessive flexure of a circuit boardcauses product failure. The purpose is to standardize the test board and test methodology toprovide a reproducible assessment of the drop test performance of surface-mountedcomponents while producing the same failure modes normally observed during product leveltest.The purpose of this standard is to prescribe a standardized test method and reportingprocedure. This is not a component qualification test and is not meant to replace any systemlevel drop test that may be needed to qualify a specific handheld electronic product. Thestandard is not meant to cover the drop test required to simulate shipping and handlingrelatedshock of electronic components or PCB assemblies. These requirements are alreadyaddressed in test methods such as IEC 60749-10. The method is applicable to both areaarray and perimeter-leaded surface mounted packages.This test method uses an accelerometer to measure the mechanical shock duration andmagnitude applied which is proportional to the stress on a given component mounted on astandard board. The test method described in the future IEC 60749-401 uses strain gauge tomeasure the strain and strain rate of a board in the vicinity of a component. The detailedspecification states which test method is to be used.