標準號：DIN EN 60068-2-58-2005
中文標準名稱：環境試驗.第2-58部分:試驗.試驗Td:表面安裝設備(SMD)的可焊性、耐金屬化溶融和耐焊接熱的試驗方法
英文標準名稱：Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004); German version EN 60068-2-58:2004 + Corrigendum 2
標準類型：A21
發布日期：1999/12/31 12:00:00
實施日期：2005/3/1 12:00:00
中國標準分類號：A21
國際標準分類號：19.040
適用范圍：This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder allays containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys.