標準號：BS EN 61192-1-2003
中文標準名稱：釬焊電子組件的工藝要求.總則
英文標準名稱：Workmanship requirements for soldered electronic assemblies - General
標準類型：J33
發布日期：2003/6/26 12:00:00
實施日期：2003/6/26 12:00:00
中國標準分類號：J33
國際標準分類號：31.190
適用范圍：This part of IEC 61192 specifies general requirements for workmanship in soldered electronic assemblies on printed boards and on similar laminates attached to the surface(s) of organic substrates. This standard does not include hybrid circuits in which the conductor metallization is deposited directly on a ceramic substrate or onto a ceramic-coated metal substrate. It includes multichip modules assembled on organic substrates but excludes them when they are assembled on inorganic substrate surfaces such as ceramic or silicon. The purpose of this standards is: a) to define requirements and guidelines for good workmanship and practice in the preparation, soldering, inspection and testing of electronic and electrical assemblies; b) to enable achievement of high yields and high product quality through process control in production: c) to enable the suppliers and users of electronic assemblies to specify good manufacturing practice as part of a contract.