標準號：BS EN 61188-5-6-2003
中文標準名稱：印制板和組件.設計和使用.附件條件.四面帶有J形引線的片狀載體
英文標準名稱：Printed boards and assemblies - Design and use - Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
標準類型：L30
發布日期：2003/6/26 12:00:00
實施日期：2003/6/26 12:00:00
中國標準分類號：L30
國際標準分類號：31.190
適用范圍：This part of IEC 61188 provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides. The object of this standard is to provide the appropriate size, shape and tolerances of surface mount land patterns so as to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of resulting solder joints. Each clause contains a specific set of criteria, setting out details on the component, the component dimensions, the solder joint design and the land pattern dimensions. NOTE The acronym QFJ is the naming convention used by Japan; the acronym PLCC is the naming convention used by the USA for these components.