標準號：DIN EN 60749-25-2004
中文標準名稱：半導體器件.機械和氣候試驗方法.第25部分:溫度循環
英文標準名稱：Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling (IEC 60749-25:2003); German version EN 60749-25:2003
標準類型：L40
發布日期：1999/12/31 12:00:00
實施日期：2004/4/1 12:00:00
中國標準分類號：L40
國際標準分類號：31.080.01
適用范圍：This part of DIN EN 60749 provides a test procedure for determining the ability of smiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremen. Permanent changes in electrical and/or physical characteristics can result from these stresses. This test applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.#,,#