標準號：IEC 60191-6-2-2001
中文標準名稱：半導體器件的機械標準化 第6-2部分：表面安裝半導體器件封裝外形圖繪制的一般規則 1.5mm,1.27mm及1.00mm小螺距球狀和柱狀端封裝的設計指南
英文標準名稱：Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
標準類型：L40
發布日期：1999/12/31 12:00:00
實施日期：1999/12/31 12:00:00
中國標準分類號：L40
國際標準分類號：01.100.25;31.240
適用范圍：This part of IEC 60191 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).