標準號：IEC 60455-1-1998
中文標準名稱：電氣絕緣用無溶劑可聚合樹脂 第1部分:定義和一般要求
英文標準名稱：Resin based reactive compounds used for electrical insulation - Part 1: Definitions and general requirements
標準類型：K15
發布日期：1999/12/31 12:00:00
實施日期：1999/12/31 12:00:00
中國標準分類號：K15
國際標準分類號：01.040.29;29.035.20
適用范圍：This part of IEC 60455 relates to resin based reactive compounds and their components used for electrical insulation. All reactive compounds are solvent-free and may contain reactive diluents and fillers. The reactions involved in curing are polymerization and/or crosslinking. This standard does not relate to reactive compounds used as coating powders. NOTE - It is intended to draw up specifications for coating powders as a separate IEC Standard having a different number. These materials may be used for a range of applications, of which common ones are shown in table 1. The code letters associated with the application may be used as abbreviation of the application description. Further applications and associated code letters may be added if so required.