作者:百檢網(wǎng) 時間:2021-12-06 來源:互聯(lián)網(wǎng)
電子制造工藝材料分析|江蘇江測檢測|規(guī)范和進(jìn)行質(zhì)量監(jiān)控
物理性能:外觀、密度、粘度、閃點、沸程、外徑、固體含量、吸水率等;
化學(xué)性能:酸值、pH 值、銅鏡腐蝕性、銅板腐蝕性、水解穩(wěn)定型、耐油性等;
工藝性能:觸變性、助焊性、潤濕性、錫槽試驗、錫珠試驗、噴濺試驗等; 電學(xué)性能:表面絕緣電阻、電化學(xué)遷移、交叉兼容性、體積 / 表面電阻率等; 化學(xué)成分:金屬及非金屬元素成分、有機(jī)化合物成分、離子成分等;
力學(xué)性能:抗拉強(qiáng)度及延伸率、彎曲強(qiáng)度、剪切強(qiáng)度、180°剝離強(qiáng)度等。
Physical property:appearance, density, viscosity, flash point, boiling distance, external diameter, solid content, water absorption, etc.
Chemical properties:acid value, PH, corrosion of copper mirror, corrosion of copper plate, stability of hydrolysis and oil resistance.
Process performance:thixotropy, solderability, wettability, tin bath test, tin bead test, splash test, etc. Electrical properties:surface insulation resistance, electrochemical migration, cross compatibility, volume / surface resistivity, etc.
Chemical composition:metallic and non-metallic elements, organic compounds, ions, etc.
Mechanical property:tensile strength and elongation, bending strength, shear strength, peel strength of 180 degree, etc.
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